国产bbaaaaa片,成年美女黄网站色视频免费,成年黄大片,а天堂中文最新一区二区三区,成人精品视频一区二区三区尤物

首頁> 外文學(xué)位 >Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging.
【24h】

Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging.

機(jī)譯：研究可熱加工環(huán)氧材料和使用碳纖維增強(qiáng)電子封裝的導(dǎo)熱性。

獲取原文
獲取原文并翻譯 | 示例
  • 摘要
  • 著錄項(xiàng)
  • 相似文獻(xiàn)
  • 相關(guān)主題

摘要

Epoxy resins are widely used as the underfill materials for the integrated circuit (IC) chips for the reliability enhancement and as the binder of electrically conductive adhesives (ECA). However, cured epoxy materials are infusible and insoluble networks which is a problem for the repair of a printed circuit board assembly packaged with epoxy materials.; In this study, six diepoxides containing aromatic moieties and low temperature degradable linkages, secondary and tertiary benzoates, and carbonates, were synthesized and characterized. Underfills based on four of these epoxides were developed and evaluated respect to their properties and reworkabilility. One of the reworkable underfills was evaluated with the 85°C/85% relative humidity test as the underfill of several ball-grid-array components on a organic board, which showed a high enhanced reliability.; Underfill materials based on a synthesized bisphenol-A diepoxide were developed for the no-flow underfill process and were evaluated regarding the application on both tin/lead and lead-free solders. The latent curing mechanism of the catalyst and the influence of fluxing agents were studied. The reworkable underfills showed satisfying overall properties on both Sn/Pb and Sn/Ag/Cu solders.; A unique approach for solving the problem of low reliability of ECAs was demonstrated. Small amount of sacrificial metal and alloy powders were added in silver flake based ECA and applied on six pad surfaces. The aging of bulk resistivity and contact resistance of ECA/metal surface pairs were studied and two alloys stabilized the contact resistance on all tested metal surfaces.; The internal heat generation of IC devices quickly increases which leads to deteriorated performance and low reliability. The thermally insulating property of polymeric underfills make this even worse with slow heat dissipation. In this study, a carbon fiber of high thermal conductivity was used together with silica in epoxy underfill materials and a 300% enhancement was observed as compared to a 45 vol.% silica filled material with comparable storage modulus and electrical resistance.
機(jī)譯：環(huán)氧樹脂被廣泛用作集成電路（IC）芯片的底部填充材料，以提高可靠性，并被用作導(dǎo)電膠（ECA）的粘合劑。然而，固化的環(huán)氧樹脂材料是不溶的和不溶的網(wǎng)絡(luò)，這對于修理用環(huán)氧樹脂材料包裝的印刷電路板組件是一個(gè)問題。在這項(xiàng)研究中，合成并表征了六種包含芳族部分和低溫可降解鍵，仲和叔苯甲酸酯和碳酸鹽的二環(huán)氧化合物。開發(fā)了基于其中四種環(huán)氧化物的底部填充膠，并對其性能和可再加工性進(jìn)行了評估。其中一種可返修的底部填充材料在85°C / 85％相對濕度測試中作為有機(jī)板上幾個(gè)球柵陣列組件的底部填充材料進(jìn)行了評估，顯示出較高的可靠性。已開發(fā)出基于合成雙酚A二環(huán)氧化合物的底部填充材料，用于無流動底部填充工藝，并對其在錫/鉛和無鉛焊料上的應(yīng)用進(jìn)行了評估。研究了催化劑的潛在固化機(jī)理和助熔劑的影響?？稍偌庸さ牡撞刻畛淠z在Sn / Pb和Sn / Ag / Cu焊料上均表現(xiàn)出令人滿意的整體性能。演示了一種解決ECA可靠性低的問題的獨(dú)特方法。將少量犧牲金屬和合金粉末添加到基于銀薄片的ECA中，并施加在六個(gè)焊盤表面上。研究了ECA /金屬表面對的體電阻率和接觸電阻的時(shí)效，兩種合金穩(wěn)定了所有測試金屬表面的接觸電阻。 IC器件的內(nèi)部發(fā)熱迅速增加，這導(dǎo)致性能下降和可靠性降低。聚合物底部填充材料的隔熱性能使這種情況變得更糟，散熱緩慢。在這項(xiàng)研究中，將高導(dǎo)熱率的碳纖維與二氧化硅一起用于環(huán)氧底層填充材料中，與具有相同儲能模量和電阻的45體積％二氧化硅填充材料相比，觀察到300％的增強(qiáng)。

著錄項(xiàng)

相似文獻(xiàn)

  • 外文文獻(xiàn)
  • 中文文獻(xiàn)
  • 專利
獲取原文

客服郵箱：kefu@zhangqiaokeyan.com

京公網(wǎng)安備：11010802029741號 ICP備案號：京ICP備15016152號-6 六維聯(lián)合信息科技 (北京) 有限公司?版權(quán)所有

  • 客服微信

  • 服務(wù)號