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首頁(yè)> 外文學(xué)位 >Experimental Study of Pool Boiling Heat Transfer Enhancement over Microchanneled Surfaces.
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Experimental Study of Pool Boiling Heat Transfer Enhancement over Microchanneled Surfaces.

機(jī)譯：微通道表面池沸騰傳熱增強(qiáng)的實(shí)驗(yàn)研究。

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Pool boiling is of interest in heat transfer applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is still not comparable to the cooling ability provided by enhanced microchannels operating under single-phase conditions. This investigation focuses on the bubble dynamics and heat transfer on plain and structured microchanneled surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism through the use of a high speed camera.;In a preliminary study, silicon chips have been tested in the nucleate boiling regime, and beneficial microchannel geometries have been identified. It is determined that heat transfer enhancement occurs because of (i) an increase in surface area and (ii) an improvement in the heat transfer mechanism through the channels functioning as liquid conduits for three side heating. The range for channel size in which the greatest enhancement occurs has been identified as being 200 -- 400 mum width and 300 -- 500 mum depth.;The second study has been investigated with copper chips, with improvements to the test setup for accurate measurement of surface temperature. Ten chips, in addition to a plain chip have been evaluated for heat transfer performance. It has been determined that surfaces with many, small hydraulic diameter channels enhance the heat transfer as well as surfaces with wide and deep channels. The best performing chip had a record heat transfer coefficient of 269 kW/m2K. The large heat fluxes of over 240 W/cm2 were attained without reaching the critical heat flux condition, because of the open channels on the surface acting as conduits for liquid supply to the nucleation sites. The microchannels prevent surface dryout and critical heat flux (CHF), while the channel width controls the size of the departing bubbles.
機(jī)譯：池沸騰在傳熱應(yīng)用中是令人關(guān)注的，因?yàn)樗袧摿θコ罅空舭l(fā)潛熱所產(chǎn)生的熱量，并且對(duì)冷卻劑在系統(tǒng)中循環(huán)的壓降影響很小。但是，池沸騰系統(tǒng)的傳熱性能仍無法與在單相條件下運(yùn)行的增強(qiáng)型微通道所提供的冷卻能力相比。這項(xiàng)研究的重點(diǎn)是在各種熱通量下的平整和結(jié)構(gòu)化微通道表面上的氣泡動(dòng)力學(xué)和傳熱，旨在通過使用高速攝像機(jī)來了解潛在的傳熱機(jī)理。在初步研究中，已經(jīng)對(duì)硅芯片進(jìn)行了測(cè)試在核沸騰過程中，已經(jīng)確定了有利的微通道幾何形狀?？梢源_定，由于（i）表面積的增加和（ii）通過用作三側(cè)加熱的液體導(dǎo)管的通道的傳熱機(jī)理的改善，導(dǎo)致傳熱增強(qiáng)?？梢源_定最大增強(qiáng)的通道尺寸范圍為200-400毫米寬度和300-500毫米深度;第二項(xiàng)研究是使用銅芯片進(jìn)行的，對(duì)測(cè)試裝置進(jìn)行了改進(jìn)以實(shí)現(xiàn)精確測(cè)量表面溫度。除普通芯片外，還評(píng)估了十個(gè)芯片的傳熱性能。已經(jīng)確定，具有許多小的水力直徑通道的表面以及具有寬而深的通道的表面都增強(qiáng)了熱傳遞。表現(xiàn)最佳的芯片的傳熱系數(shù)為269 kW / m2K。由于表面上的開放通道充當(dāng)向成核位點(diǎn)供應(yīng)液體的管道，因此在沒有達(dá)到臨界熱通量條件的情況下獲得了超過240 W / cm2的大熱通量。這些微通道可防止表面變干和臨界熱通量（CHF），而通道寬度則控制著氣泡的大小。

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  • 作者

    Cooke, Dwight.;

  • 作者單位

    Rochester Institute of Technology.;

  • 授予單位 Rochester Institute of Technology.;
  • 學(xué)科 Engineering Mechanical.
  • 學(xué)位 M.S.
  • 年度 2011
  • 頁(yè)碼 86 p.
  • 總頁(yè)數(shù) 86
  • 原文格式 PDF
  • 正文語(yǔ)種 eng
  • 中圖分類 公共建筑;
  • 關(guān)鍵詞

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