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首頁(yè)> 外文學(xué)位 >Micromachined floating element shear force sensors for use in CMP.
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Micromachined floating element shear force sensors for use in CMP.

機(jī)譯：用于CMP的微機(jī)械浮動(dòng)元件剪切力傳感器。

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摘要

The design and fabrication of a microscale shear force sensor for use in Chemical Mechanical Polishing (CMP) is presented. This sensor is intended to sense local scale shear forces induced by contact between surface features on a silicon wafer and asperities on a polishing pad. This sensor was designed using mask layout techniques and simulated using a lumped element model. This model predicted the dynamic response of the sensor to a frequency domain input. The sensor was fabricated using bulk micromachining and the bonded lost wafer process. In this process features are etched into the surface of a Silicon On Insulator (SOI) wafer. The SOI wafer is then bonded to a glass wafer using a technique known as anodic bonding. Next, the majority of the SOI wafer is dissolved using chemical etchants, and a second etch releases the sensor elements from a layer of silicon dioxide. The sensors did not survive the fabrication process. Failure modes included incomplete bonding, difficulties with a through wafer wet etch using potassium hydroxide and failure of devices caused by pressure differences induced during wafer bonding. Failure modes as well as recommendations for resolution are presented in full detail. Electromechanical test data for a similar sensor was obtained to demonstrate the applicability of the modeling and characterization procedures.
機(jī)譯：介紹了用于化學(xué)機(jī)械拋光（CMP）的微型剪切力傳感器的設(shè)計(jì)和制造。該傳感器旨在感測(cè)由硅晶片上的表面特征與拋光墊上的凹凸之間的接觸所引起的局部尺度剪切力。該傳感器使用掩膜版圖技術(shù)設(shè)計(jì)，并使用集總元素模型進(jìn)行仿真。該模型預(yù)測(cè)了傳感器對(duì)頻域輸入的動(dòng)態(tài)響應(yīng)。該傳感器是使用批量微機(jī)械加工和鍵合丟失晶圓工藝制造的。在該工藝中，將特征蝕刻到絕緣體上硅（SOI）晶圓的表面。然后使用稱為陽(yáng)極鍵合的技術(shù)將SOI晶圓鍵合到玻璃晶圓上。接下來(lái)，使用化學(xué)蝕刻劑溶解大部分SOI晶片，然后進(jìn)行第二次蝕刻，從二氧化硅層釋放傳感器元件。傳感器無(wú)法在制造過(guò)程中幸存下來(lái)。失敗模式包括不完全鍵合，使用氫氧化鉀的晶圓濕法蝕刻困難以及由于晶圓鍵合過(guò)程中引起的壓差而導(dǎo)致的器件故障。詳細(xì)介紹了故障模式以及解決方案的建議。獲得了類似傳感器的機(jī)電測(cè)試數(shù)據(jù)，以證明建模和表征程序的適用性。

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  • 作者

    Gauthier, Douglas A.;

  • 作者單位

    Tufts University.;

  • 授予單位 Tufts University.;
  • 學(xué)科 Engineering Mechanical.
  • 學(xué)位 M.S.
  • 年度 2009
  • 頁(yè)碼 102 p.
  • 總頁(yè)數(shù) 102
  • 原文格式 PDF
  • 正文語(yǔ)種 eng
  • 中圖分類 機(jī)械、儀表工業(yè);
  • 關(guān)鍵詞

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