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首頁(yè)> 外文學(xué)位 >Optimal micro heat pipe configuration on high performance heat spreaders.
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Optimal micro heat pipe configuration on high performance heat spreaders.

機(jī)譯：高性能散熱器上的最佳微型熱管配置。

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The purpose of this research was to determine the optimal micro heat pipe (MHP) configuration on high performance heat spreaders. The ultimate goal was to reduce the spreading resistance and eliminate localized hot spots. Hot spots occur when the temperature is not evenly distributed throughout an area. To reduce these hot spots, an array of micro heat pipes was implemented into the heat spreader. Seven array configurations, ranging from 2 MHPs to 8 MHPs, were evaluated for a range of power inputs varying from 3 W to 21 W. The finite element software, MECHANICA 4.0, was utilized for the simulations. Through a comprehensive literature review, it was determined that evaluating the MHP limitations and finding an effective thermal conductivity were beyond the scope of this research. Therefore, a simplified equation was used for the MHP limitations, and the simulations were carried out for conductivities of 5,000 W/m°C, 50,000 W/m°C, and 100,000 W/m°C. The convective boundary condition was also varied to determine its effect on spreading resistance.;It was determined that the spreading resistance was independent of the convection coefficient and power input for a specific MHP effective thermal conductivity. The spreading resistance decreased with increasing effective thermal conductivities until the conductivity reached about 50,000 W/m°C, at which point the spreading resistance leveled off. The spreading resistance was found to decrease with increasing numbers of MHPs in the array. Overall, MHPs did aid in decreasing the spreading resistance.
機(jī)譯：本研究的目的是確定高性能散熱器上的最佳微型熱管（MHP）配置。最終目標(biāo)是降低擴(kuò)展阻力并消除局部熱點(diǎn)。當(dāng)溫度在整個(gè)區(qū)域中分布不均時(shí)，就會(huì)出現(xiàn)熱點(diǎn)。為了減少這些熱點(diǎn)，在散熱器中安裝了一系列微型熱管。對(duì)功率范圍從3 W到21 W的7種陣列配置（范圍從2 MHPs到8 MHPs）進(jìn)行了評(píng)估。仿真使用了有限元軟件MECHANICA 4.0。通過(guò)全面的文獻(xiàn)綜述，可以確定評(píng)估MHP的局限性并找到有效的熱導(dǎo)率超出了本研究的范圍。因此，對(duì)于MHP限制使用簡(jiǎn)化的方程式，并針對(duì)電導(dǎo)率5,000 W / m°C，50,000 W / m°C和100,000 W / m°C進(jìn)行了仿真。還改變了對(duì)流邊界條件，以確定其對(duì)擴(kuò)展阻力的影響。確定對(duì)特定的MHP有效導(dǎo)熱系數(shù)，擴(kuò)展阻力與對(duì)流系數(shù)和功率輸入無(wú)關(guān)。擴(kuò)散電阻隨著有效熱導(dǎo)率的增加而降低，直到電導(dǎo)率達(dá)到約50,000 W / m°C，此時(shí)擴(kuò)散電阻趨于穩(wěn)定。已發(fā)現(xiàn)，隨著陣列中MHP數(shù)量的增加，擴(kuò)散阻力會(huì)降低?？傮w而言，MHP確實(shí)有助于降低擴(kuò)展阻力。

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