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Numerical modeling of the performance of thermal interface materials.

機(jī)譯：熱界面材料性能的數(shù)值模擬。

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Thermal interface materials are needed for improving thermal contacts, such as those in microelectronics. Finite element modeling is conducted to understand the factors that govern the performance of thermal interface materials of controlled thickness in the form of thermal pastes or paste-coated-sheets between copper surfaces of controlled roughness. Good agreement is found between modeling and experimental results that involve copper proximate surfaces of controlled roughness sandwiching the thermal interface material of controlled thickness.;Comparative evaluation is made on two contrasting pastes, namely a carbon black paste and a commercial metal particle paste. The carbon black paste is lower in thickness than the metal particle paste, so it gives better performance. The performance of both pastes is more influenced by the paste-copper interfacial conductance than the paste thermal conductivity. The effects of pressure, paste thickness and copper surface roughness on the performance are mainly due to the change in the fractional filling of the valleys in the copper surface topography.;In case of paste-coated sheets, the coating on both sides of a core sheet is the carbon black paste and it serves to improve the conformability. The core sheets are copper foil, aluminum foil, indium foil and flexible graphite. Flexible graphite (made from exfoliated graphite) is advantageous in its low elastic modulus, whereas copper and aluminum foils are advantageous in their high thermal conductivity. Indium is advantageous in its low elastic modulus compared to copper or aluminum and in its high thermal conductivity compared to flexible graphite. Among the four types of core sheet with identical thickness, coated indium foil gives the best performance for a range of foil thickness, which is 6-112 mum for the case of smooth (15 mum roughness) proximate surfaces and 117-320 mum for the case of rough (0.01 mum roughness) proximate surfaces. Aluminum foil gives the best performance for a thickness range of 112-2000 mum in the case of smooth proximate surfaces. For thicknesses below these ranges, flexible graphite performs the best. For thicknesses above these ranges, copper foil performs the best.
機(jī)譯：需要熱界面材料來改善熱接觸，例如微電子學(xué)中的那些。進(jìn)行有限元建模以了解控制可控厚度的熱界面材料的性能的因素，這些可控厚度以可控粗糙度的銅表面之間的導(dǎo)熱膠或?qū)崮z涂層的形式存在。在建模和實(shí)驗(yàn)結(jié)果之間找到了很好的一致性，其中涉及到具有受控粗糙度的銅鄰近表面，并夾有厚度受控的熱界面材料。對(duì)兩種對(duì)比色的糊劑，即炭黑糊劑和商用金屬顆粒糊劑，進(jìn)行了比較評(píng)估。炭黑漿料的厚度低于金屬顆粒漿料的厚度，因此具有更好的性能。兩種糊的性能受糊-銅界面電導(dǎo)的影響要大于糊的導(dǎo)熱率。壓力，焊膏厚度和銅表面粗糙度對(duì)性能的影響主要是由于銅表面形貌中的谷部分?jǐn)?shù)填充的變化所致。薄片是炭黑糊劑，其用于改善貼合性。芯板是銅箔，鋁箔，銦箔和柔性石墨。撓性石墨（由剝離石墨制成）在低彈性模量方面是有利的，而銅箔和鋁箔的高導(dǎo)熱率是有利的。與銅或鋁相比，銦的彈性模量低，而與柔性石墨相比，銦的導(dǎo)熱率高。在四種厚度相同的芯板中，涂有銦箔的鋁箔在一定范圍的箔厚度下具有最佳性能，對(duì)于光滑的表面（粗糙度為15um），其厚度為6-112 mum，對(duì)于表面厚度為117-320 mm的情況，則為117-320 mum?？拷砻娴那闆r（粗糙度為0.01 mum）。在光滑的近表面上，鋁箔在112-2000微米的厚度范圍內(nèi)具有最佳性能。對(duì)于低于這些范圍的厚度，柔性石墨表現(xiàn)最佳。對(duì)于超過這些范圍的厚度，銅箔表現(xiàn)最佳。

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