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首頁> 外文期刊>Journal of Applied Physics >Capture and emission mechanisms of defect states at interface between nitride semiconductor and gate oxides in GaN-based metal-oxide- semiconductor power transistors
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Capture and emission mechanisms of defect states at interface between nitride semiconductor and gate oxides in GaN-based metal-oxide- semiconductor power transistors

機(jī)譯:GaN基金屬氧化物半導(dǎo)體功率晶體管氮化物半導(dǎo)體和柵極氧化物界面界面缺陷狀態(tài)的捕獲和排放機(jī)制

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摘要

A physical insight into the capture and emission behavior of interface/oxide states in a GaN-based metal-oxide-semiconductor (MOS) structure is of great importance to understanding the threshold voltage (V-TH) instability in GaN power transistors. A time-dependent V-TH shift in Ni/Al2O3/AlGaN/GaN MOS-HFETs (heterojunction field-effect transistors) and a distribution of Al2O3/III-nitride interface states (D-it) were successfully characterized by constant-capacitance deep level transient spectroscopy. It is found that in situ remote plasma pretreatments in plasma-enhanced atomic-layer-deposition could suppress Dit (E-C-E-T 0.4 eV) down to below 1.3 x 10(12) cm(-2) eV(-1). Under high applied gate bias (e.g., V-G 8 V), tunnel filling of oxide states in the Al2O3 dielectric comes into play, contributing to remarkable V-TH instability in the MOS-HFETs. The tunnel distance between the 2D Electron Gas (2DEG) channel and oxide states E-T,E-ox in the Al2O3 dielectric decreases from 3.75 to 0.82 nm as VG increases from 2 to 8 V. A further increase of V-G to 11 V makes the Fermi level approach E-T,E-ox (E-C - E-T similar to 1.62 eV), which may enable direct filling. High electric field induced tunnel filling of gate oxide states could be an assignable cause for VTH instability in normally-OFF III-nitride MOS-HFETs. Published under license by AIP Publishing.
機(jī)譯:在GaN基金屬 - 氧化物 - 半導(dǎo)體(MOS)結(jié)構(gòu)中對界面/氧化物狀態(tài)的捕獲和排放行為的物理見解非常重要,可以理解GaN功率晶體管中的閾值電壓(V-Th)不穩(wěn)定性。通過恒定電容深度成功地表征了Ni / Al2O3 / AlGaN / GaN MOS-HFET(異質(zhì)結(jié)場效應(yīng)晶體管)和Al2O3 / III-氮化物界面狀態(tài)(D-IT)的分布的時(shí)間依賴性的第V班。水平瞬態(tài)光譜。發(fā)現(xiàn),原位遠(yuǎn)程血漿預(yù)處理等離子體增強(qiáng)的原子層沉積可以抑制低于1.3×10(12)厘米(-2)EV(-1)的DIT(E-C-E-T> 0.4eV)。在高施加的柵極偏置(例如,V-G> 8V)下,Al2O3電介質(zhì)中的氧化物狀態(tài)的隧道填充到發(fā)揮作用,有助于MOS-HFET中的顯著V-TH不穩(wěn)定性。 Al2O3電介質(zhì)中的2D電子氣(2deg)通道和氧化物狀態(tài)等的隧道距離從3.75?0.82nm降低,因?yàn)閂g從2?8 V增加。Vg至11V的進(jìn)一步增加使得費(fèi)米成為Fermi水平方法ET,E-OX(EC-ET類似于1.62eV),可以實(shí)現(xiàn)直接填充。高電場誘導(dǎo)柵極氧化物狀態(tài)的隧道填充可以是常常氮化物MOS-HFET中的Vth不穩(wěn)定性的可分配原因。通過AIP發(fā)布在許可證下發(fā)布。

著錄項(xiàng)

  • 來源
    《Journal of Applied Physics》 |2019年第16期|164505.1-164505.8|共8頁
  • 作者單位

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Sch Microelect Beijing 100049 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Sch Microelect Beijing 100049 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Sch Microelect Beijing 100049 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Sch Microelect Beijing 100049 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Sch Microelect Beijing 100049 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Devices & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Sch Microelect Beijing 100049 Peoples R China;

    Chinese Acad Sci Suzhou Inst Nanotech & Nanobion Suzhou 215123 Peoples R China;

    Hong Kong Univ Sci & Technol Dept Elect & Comp Engn Kowloon Hong Kong 999077 Peoples R China;

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  • 正文語種 eng
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