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Microelectromechanical Systems (MEMS) and Solder Self-Assembly for 3-D MEMS and MEMS Arrays.

機譯：用于3-D mEms和mEms陣列的微機電系統(tǒng)（mEms）和焊料自組裝。

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One method of MEMS manufacturing is surface micromachining. The challenge of this method is its inability to produce structures with high aspect ratio due to its planar fabrication. The surface micromachined structures, however, can be assembled out of the plane of the substrate to achieve a 3- dimensional function. A common solution for assembly of highly 3-D MEMS is the fabrication of hinged components that can be lifted or 'popped-up' into assembled structures. The hinged structures then can be combined with microactuators for positioning and operating MEMS. Hinged devices are commonly assembled manually, a time consuming and delicate process which leads to low yield and inability to produce devices in large quantities. The research objective of our work focused on elimination of fabrication limitations by using two novel self-assembly techniques for MEMS: assembly using integrated micromechanisms (MEMS Self-Assembly), and assembly using a solder re-flow process (Solder Self-Assembly). The self-assembly of MEMS eliminates the need for manual assembly or adjustment, thus making batch fabrication feasible. In addition to manufacturability, the self-assembly of MEMS may be particularly important for applications which require reliable deployment and remote assembly of delicate structures in the operating environment or readjustment of components to align a system for optimal performance. This work was divided into eight sections: The study and development of self-assembled corner cube reflectors, self assembled 3-D switches, 3-D micro-robot leggs, hybrid assembly structures, and advanced structures, design for MEMS mechanism driven self- assembly, design for surface tension driven self-assembly, and quality and reliability of self-assembled MEMS.

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