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首頁> 外國專利> POLYMER COMPOSITION WITH EXCELLENT THERMAL CONDUCTIVITY PRODUCED BY USING COMPRESSION MOLDING METHOD AND PRODUCT OF POLYMER COMPOSITION WITH EXCELLENT THERMAL CONDUCTIVITY MANUFACTURED BY USING SAME

POLYMER COMPOSITION WITH EXCELLENT THERMAL CONDUCTIVITY PRODUCED BY USING COMPRESSION MOLDING METHOD AND PRODUCT OF POLYMER COMPOSITION WITH EXCELLENT THERMAL CONDUCTIVITY MANUFACTURED BY USING SAME

機(jī)譯：用壓模法生產(chǎn)的具有優(yōu)良導(dǎo)熱性的聚合物組合物和用相同的方法制造的具有優(yōu)良的導(dǎo)熱性的聚合物組合物

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The present invention provides a polymer composition including 10-90 wt% of a heat resistance polymer resin and 10-90 wt% of a theromoconductive filler with respect to the total weight of the polymer composition. The thermoconductive filler has anisotropy. The polymer composition is obtained by mixing, compressing, and molding the heat resistance polymer resin in a powder type with the thermoconductive filler. According to the present invention, the polymer composition includes the thermoconductive filler, which has an excessive amount of anisotropy and is uniformly dispersed in the polymer composition compared to an existing composition. An effective network between the fillers is formed by using the thermoconductive filler, which is uniformly dispersed and has anisotropy. Therefore, a contact ratio is increased, and thermal conductivity is very excellent. In addition, the polymer composition can be widely used in an electronic component industry and a semiconductor industry as a commercialized filler is used and a production process is simple.;COPYRIGHT KIPO 2016
機(jī)譯：本發(fā)明提供了一種聚合物組合物，其相對于該聚合物組合物的總重量包含10-90重量％的耐熱性聚合物樹脂和10-90重量％的導(dǎo)熱性填料。導(dǎo)熱填料具有各向異性。該聚合物組合物通過將粉末狀的耐熱性高分子樹脂與導(dǎo)熱性填料混合，壓縮，成型而得到。根據(jù)本發(fā)明，該聚合物組合物包括導(dǎo)熱填料，該導(dǎo)熱填料與現(xiàn)有組合物相比具有過量的各向異性并且均勻地分散在該聚合物組合物中。通過使用均勻分散并且具有各向異性的導(dǎo)熱填料，在填料之間形成有效的網(wǎng)絡(luò)。因此，增加了接觸比，并且導(dǎo)熱率非常好。此外，該聚合物組合物可廣泛用于電子元件行業(yè)和半導(dǎo)體行業(yè)，因?yàn)樗褂昧松虡I(yè)化的填料，并且生產(chǎn)工藝簡單。

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