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首頁> 外國專利> Opto-electronic semiconductor component, has main housing body surrounding opto-electronic semiconductor chip and made of radiation permeable matrix material, and radiation reflected filling material introduced into body

Opto-electronic semiconductor component, has main housing body surrounding opto-electronic semiconductor chip and made of radiation permeable matrix material, and radiation reflected filling material introduced into body

機(jī)譯:光電半導(dǎo)體組件,具有包圍光電半導(dǎo)體芯片并由輻射可穿透的基體材料制成的主殼體,以及將輻射反射的填充材料引入殼體中

摘要

The component has a main housing body (1) surrounding an opto-electronic semiconductor chip (2) e.g. photodiode chip, and made of radiation permeable matrix material (3) e.g. fluoropolymer and modified polytetrafluoroethylene. A radiation reflected filling material (4) is introduced into the body, and includes metallic particles, mineral particles and particles e.g. titanium dioxide, aluminum oxide, zinc oxide, and barium sulfate. A mechanically stabilized filling material (5) is brought into the matrix material and is provided with mineral fibers e.g. glass fibers and carbon fibers.
機(jī)譯:該部件具有主體殼體(1),該主體殼體(1)圍繞例如光電半導(dǎo)體芯片(2)。光電二極管芯片,并且由輻射可透過的基質(zhì)材料(3)制成,例如含氟聚合物和改性聚四氟乙烯。輻射反射的填充材料(4)被引入體內(nèi),并且包括金屬顆粒,礦物顆粒和例如金屬顆粒。二氧化鈦,氧化鋁,氧化鋅和硫酸鋇。將機(jī)械穩(wěn)定的填充材料(5)放入基體材料中,并配有礦物纖維,例如礦物纖維。玻璃纖維和碳纖維。

著錄項(xiàng)

  • 公開/公告號(hào)DE102009036622A1

    專利類型

  • 公開/公告日2011-02-10

    原文格式PDF

  • 申請(qǐng)/專利權(quán)人 OSRAM OPTO SEMICONDUCTORS GMBH;

    申請(qǐng)/專利號(hào)DE20091036622

  • 發(fā)明設(shè)計(jì)人 KRAEUTER GERTRUD;BARCHMANN BERND;RAUKAS MADIS;

    申請(qǐng)日2009-08-07

  • 分類號(hào)H01L33/56;H01L33/60;H01L33/62;H01L31/0203;H01L23/04;H01S5/02;

  • 國家 DE

  • 入庫時(shí)間 2022-08-21 17:47:48

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