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首頁> 外國(guó)專利> GRINDING PROCESS FOR A CONNECTED WORKPIECE OBTAINED BY CONNECTING TRANSPARENT COMPONENTS OR SEMITRANSPARENT COMPONENTS

GRINDING PROCESS FOR A CONNECTED WORKPIECE OBTAINED BY CONNECTING TRANSPARENT COMPONENTS OR SEMITRANSPARENT COMPONENTS

機(jī)譯：通過連接透明部件或半透明組分獲得的連接工件的研磨工藝

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摘要

A grinding method includes a step of imaging a connected workpiece by a camera in such a manner that the outer periphery of a workpiece and the outer periphery of a supporting component having a larger diameter than that of the workpiece before a step of supporting the supporting component include the connected workpiece by a holding surface is. The grinding method also includes a step of recognizing the outer periphery of the supporting component and the outer periphery of the workpiece based on the brightness difference between adjacent pixels in a captured image and a step of recognizing the center of the supporting component from the recognized outer periphery of the supporting component and recognizing the center of the workpiece from the recognized outer circumference of the workpiece.
機(jī)譯：研磨方法包括通過相機(jī)成像連接的工件的步驟，使得工件的外周和支撐部件的外周具有比在支撐支撐部件的步驟之前具有比工件更大的支撐部件的外周 通過保持表面包括連接的工件。 研磨方法還包括基于捕獲圖像中的相鄰像素之間的亮度差來識(shí)別支撐部件的外周和工件的外周的步驟，以及從識(shí)別的外部識(shí)別支撐部件的中心的步驟 支撐部件的周邊并識(shí)別工件的中心從工件的識(shí)別的外圓周。

著錄項(xiàng)

  • 公開/公告號(hào)DE102021205152A1

    專利類型

  • 公開/公告日2021-12-02

    原文格式PDF

  • 申請(qǐng)/專利權(quán)人 DISCO CORPORATION;

    申請(qǐng)/專利號(hào)DE202110205152

  • 發(fā)明設(shè)計(jì)人 NOBUYUKI FUKUSHI;

    申請(qǐng)日2021-05-20

  • 分類號(hào)H01L21/463;H01L21/683;

  • 國(guó)家 DE

  • 入庫時(shí)間 2024-06-14 22:23:18

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